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Product name:

FMT8E32UAB

Density:2Gb LPDDR2

P/N:FMT8E32UAB

Voltage:VDD1:1.70~1.95V VDD2:1.14~1.30V VDDQ/VDDCA:1.14~1.30V

Refresh:8K

Org:x32

Clock Rate:400MHz/533MHz

PKG(mm):134B FBGA(10x11.5x1mm)

Temp:-40℃~85℃

Status:MP

Details
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Feature

• Functionality

- VDD2 = 1.14–1.30V

- VDDCA/VDDQ = 1.14–1.30V

- VDD1 = 1.70–1.95V

- Interface : HSUL_12

- Data width : X32

- Clockfrequencyrange : max 533MHz

- Four-bitpre-fetchDDR architecture

- Eight internalbanksforconcurrentoperation

- Multiplexed,doubledata rate,command/address inputs; commandsenteredon every CK edge

- Bidirectional/differentialdata strobeper byte of data(DQS/DQS#).

- DM masks write date at the both rising and falling edge of the data strobe

- ProgrammableREAD and WRITElatencies(RL/WL)

- Programmableburstlengths:4,8, or16

- Auto refresh and self refresh supported

- All bank auto refresh and per bank auto refresh supported

- Clockstopcapability
• Configuration

- 128 Meg X 16 (16 Meg X16 X 8 Banks).

- 64 Meg X 32 (8 Meg X 32 X 8 Banks).

• Low Power Features

- Low voltage power supply.

- Auto TCSR (Temperature Compensated Self Refresh).

- PASR (Partial Array Self Refresh) power-saving mode.

- DPD (Deep Power Down) Mode.

- DS (Driver Strength) Control.

• Timing –Cycle time

- 1.875ns@ RL = 8

- 2.5ns @ RL = 6

- 3.0ns @ RL = 5

• Operating Temperature Ranges

- Commercial (0℃ to +70℃).

- Extended (-25℃ to +85℃).

- Industrial (-40℃ to +85℃).

• Package

- 134-Ball FBGA(10.0mm x 11.5mm x 1.0mm)

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