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Product name:

FMD8B16LCH

Density: 256Mb LPDDR1

P/N: FMD4A16LDH

Voltage: 1.7V~1.95V

Refresh: 8K

Org: X16

Clock Rate: 200MHz@CL3

PKG(mm): 60B FBGA(8x9x0.8mm)

Temp: -40℃~85℃

Status: MP

Details
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• Functionality

- Double-data-rate architecture ; two data transfers per CLK cycle.

- Bidirectional data strobe per byte data (DQS).

- No DLL ; CLK to DQS is not Synchronized.

- Differential CLK inputs( CLK and /CLK ).

- Commands entered on each positive CLK edge.

- DQS edge-aligned with data for Reads; center-aligned with data for Writes.

- Four internal banks for concurrent operation.

- Data masks (DM) for masking write data-one mask per byte.

- Programmable burst lengths : 2, 4, 8, 16.

- Programmable CAS Latency : 2, 3.

- Concurrent auto pre-charge option is supported.

- Auto refresh and self refresh modes.

- Status read register (SRR)

- LVCMOS-compatible inputs.

• Configuration

- 16 Meg X 16 (4 Meg X 16 X 4Bank ).
• Low Power Features

- Low voltage power supply.

- Auto TCSR (Temperature Compensated Self Refresh).

- Partial Array Self Refresh power-saving mode.

- Deep Power Down Mode.

- Driver Strength Control.

• Operating Temperature Ranges

- Commercial (0℃ to +70℃).

- Extended (-25℃ to +85℃).

- Industrial (-40℃ to +85℃).

- Automotive (-40℃ to +105℃).

• Package

- 60-Ball FBGA ( 8 X 9 X 0.8mm )

• Functional Description The FMD8B16LCx Family is high-performance CMOS Dynamic RAMs (DRAM) organized as 16M x 16. These devices feature advanced circuit design to provide low active current and extremely low standby current. The device is compatible with the JEDEC standard Low Power DDR SDRAM specifications.

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